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Foxconn setting up chip packaging and testing venture with India’s HCL

Foxconn has set up a joint venture with Indian IT giant HCL Group to establish its semiconductor packaging and testing operations in India, as the Apple manufacturing partner looks to expand its presence in the South Asian nation to reduce reliance on China. As a part of the deal, Foxconn Hon Hai Technology India Mega […]
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Source: TECCRUCH

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